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dc.contributor.authorМустафаева, Нилуфар Мойли қизи
dc.date.accessioned2025-10-18T04:55:52Z
dc.date.available2025-10-18T04:55:52Z
dc.date.issued2025-06
dc.identifier.issn3060-4567
dc.identifier.urihttps://dspace.kstu.uz/xmlui/handle/123456789/578
dc.description.abstractThis article presents the results of the formation of a multilayer nanosystem Si/NiSi2/Si obtained by solid-phase deposition. The study focuses on the composition, morphology, and electronic structure of the silicon nanolayer on the surface of the epitaxial NiSi2/Si(111) structure at high temperatures. It is shown that at a temperature of 1000 K, a continuous polycrystalline silicon film is formed, whereas at 1150 K, the film breaks down and intense nickel diffusion occurs. It is also established that under certain conditions, epitaxial NiSi₂ films with good ohmic properties can be formed. The obtained results have practical significance for the development of high-frequency transistors and next-generation integrated circuits.en_US
dc.language.isootheren_US
dc.publisherMODERN EDUCATION AND DEVELOPMENTen_US
dc.subjectnanosystem, silicon, nickel silicide, epitaxy, solid-phase deposition, diffusion, ohmic contact.en_US
dc.titleФОРМИРОВАНИЕ МНОГОСЛОЙНОЙ НАНОСИСТЕМЫ Si/NiSi2/Si, ПОЛУЧЕННЫХ МЕТОДОМ ТВЕРДОФАЗНОГО ОСАЖДЕНИЯen_US
dc.title.alternativeFORMATION OF A MULTILAYER NANOSYSTEM Si/NiSi2/Si, OBTAINED BY THE METHOD OF SOLID-PHASE DEPOSITIONen_US


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